Benefits & Features
- Space-saving due to integration of several HPC modules into one box
- Flexible, modular approach with exchangeable HPC modules
- Reuse of modules in multiple vehicles without re-design allows faster time-to-market
- Thermal management by a powerful integrated fluid cooling system
- Internal PCIe bus for high bandwidth communication between the several HPC modules
- Integrated DC/DC power supply with redundancy for safety purposes
- Modular or customer specific external connectors with high-speed communication interfaces and high-current power supply
- Simplified warranty repairs
Technical Information
Cross function/domain integration: AD, Cockpit, Body, Safety & Motion
HPC integration: fully or partly integrated or modular approach
Fluid cooling performance: up to 1KW
Internal communication busses, e.g.: CAN, I²C, LIN, GB ETH, PCIe
External communication busses, e.g.: CAN, LIN, GB ETH, PCIe
Internal Power supply: DC/DC up to ~1KW with 12V power supply from vehicle (other voltages are possible)
Dimensions: customer specific